	US 12,230,579 B2
	Electronic components for soft, flexible circuitry layers and methods therefor
Madison Thea Maxey, New York, NY (US); Ezgi Ucar, Istanbul (TR); and Janett Martinez, Queens, NY (US)
Assigned to LOOMIA Technologies, Inc., Culver City, CA (US)
Filed by LOOMIA Technologies, Inc., Culver City, CA (US)
Filed on Sep. 22, 2023, as Appl. No. 18/472,784.
Application 18/472,784 is a continuation of application No. 17/747,780, filed on May 18, 2022, granted, now 11,798,891.
Application 17/747,780 is a continuation of application No. 16/657,239, filed on Oct. 18, 2019, granted, now 11,342,271, issued on May 24, 2022.
Application 16/657,239 is a continuation of application No. 15/994,351, filed on May 31, 2018, granted, now 10,490,507, issued on Nov. 26, 2019.
Prior Publication US 2024/0014141 A1, Jan. 11, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/538 (2006.01); H01L 23/50 (2006.01); H01L 33/62 (2010.01); H01R 12/77 (2011.01)

CPC H01L 23/5387 (2013.01) [H01L 23/50 (2013.01); H01L 23/5386 (2013.01); H01L 33/62 (2013.01); H01R 12/77 (2013.01)]

20 Claims

17. A method for manufacturing a flexible circuitry layer, comprising:

providing a first piece of conductive mesh including at least one high-pitch circuitry trace component, the first piece of conductive mesh configured to be in electrical connection with a lighting component;

providing a second piece of conductive mesh, wherein deformation of the first piece of conductive mesh relative to the second piece of conductive mesh is operative to control the lighting component;

connecting the at least one high-pitch circuitry trace component to a terminal of an interfacing component, the interfacing component including at least one low-pitch circuitry trace component;

applying an insulating layer to the high-pitch circuitry trace component; and

applying an encapsulation layer to the interfacing component.