US 12,230,576 B2
Chip-on-film package and display apparatus including the same
Jaemin Jung, Seoul (KR); Jeongkyu Ha, Hwaseong-si (KR); and Sanguk Han, Asan-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Jan. 20, 2022, as Appl. No. 17/579,635.
Claims priority of application No. 10-2021-0016276 (KR), filed on Feb. 4, 2021.
Prior Publication US 2022/0246530 A1, Aug. 4, 2022
Int. Cl. H01L 23/538 (2006.01); H01L 25/18 (2023.01); H05K 1/18 (2006.01); H01L 23/00 (2006.01); H01L 23/373 (2006.01)
CPC H01L 23/5385 (2013.01) [H01L 25/18 (2013.01); H05K 1/189 (2013.01); H01L 23/3735 (2013.01); H01L 23/5387 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H05K 2201/10128 (2013.01); H05K 2201/10136 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/10378 (2013.01); H05K 2201/10446 (2013.01); H05K 2201/10522 (2013.01); H05K 2201/1053 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A chip on film (COF) package comprising:
a base film having an upper surface and a lower surface opposite to each other;
a bridge film having an edge that overlaps the base film, and an upper surface and a lower surface opposite to each other;
a display driver integrated circuit (IC) mounted on the upper surface of the base film; and
a heat dissipation member arranged in correspondence with the display driver IC on the lower surface of the base film,
wherein the upper surface of the base film and the lower surface of the bridge film adhere to each other in their respective longest axis directions,
wherein a longest axis length of the bridge film is greater than a longest axis length of the base film, and
wherein a first width of each first conduct line arranged on the upper surface of the base film is less than a second width of each second conductive line arranged on the lower surface of the bridge film.