US 12,230,564 B2
Package substrate z-disaggregation with liquid metal interconnects
Brandon Christian Marin, Gilbert, AZ (US); Tarek A. Ibrahim, Mesa, AZ (US); Karumbu Nathan Meyyappan, Portland, OR (US); Valery Ouvarov-Bancalero, Scottsdale, AZ (US); and Dingying Xu, Chandler, AZ (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Jun. 11, 2021, as Appl. No. 17/345,912.
Prior Publication US 2022/0399263 A1, Dec. 15, 2022
Int. Cl. H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/538 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2023.01); H01L 25/18 (2023.01)
CPC H01L 23/49883 (2013.01) [H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/486 (2013.01); H01L 21/4867 (2013.01); H01L 23/5381 (2013.01); H01L 23/5383 (2013.01); H01L 23/5384 (2013.01); H01L 23/5385 (2013.01); H01L 23/5386 (2013.01); H01L 24/16 (2013.01); H01L 25/0655 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H01L 2224/16227 (2013.01)] 25 Claims
OG exemplary drawing
 
1. An apparatus comprising:
a first substrate component comprising:
a plurality of first conductive contacts located on a face of the first substrate component;
one or more first interconnect layers comprising conductive traces; and
one or more first dielectric layers, individual of the first interconnect layers disposed between adjacent first dielectric layers;
a second substrate component comprising:
one or more second dielectric layers;
a plurality of first coupling components comprising liquid metal;
a plurality of second coupling components comprising liquid metal; and
a plurality of through holes extending through the second dielectric layers, individual of through holes having a first coupling component disposed at a first end of the individual through hole and a second coupling component disposed at a second end of the individual through hole that opposes the first end of the individual through hole; and
a third substrate component comprising:
a plurality of second conductive contacts located on a face of the third substrate component;
one or more second interconnect layers comprising conductive traces; and
one or more third dielectric layers, individual of the second interconnect layers disposed between adjacent third dielectric layers;
wherein the plurality of the first coupling components connect to the plurality of the first conductive contacts;
wherein the plurality of the second coupling components connect to the plurality of the second conductive contacts; and
wherein the second substrate component is disposed between the first substrate component and the third substrate component.