US 12,230,562 B2
Three-dimensional pad structure and interconnection structure for electronic devices
Chin-Chiang Chang, Hsinchu (TW)
Assigned to MEDIATEK INC., Hsinchu (TW)
Filed by MEDIATEK INC., Hsin-Chu (TW)
Filed on Mar. 9, 2022, as Appl. No. 17/691,056.
Claims priority of provisional application 63/171,637, filed on Apr. 7, 2021.
Prior Publication US 2022/0328394 A1, Oct. 13, 2022
Int. Cl. H01L 23/498 (2006.01); H01L 23/31 (2006.01)
CPC H01L 23/49838 (2013.01) [H01L 23/49816 (2013.01); H01L 23/3128 (2013.01)] 27 Claims
OG exemplary drawing
 
23. A three-dimensional pad structure, comprising:
a substrate;
a pad disposed on the substrate, wherein a perimeter of the pad is covered with a solder mask; and
recessed regions provided on a top surface of the pad, wherein the recessed regions are interconnected with one another to form a network or interlacing pattern; and
at least one protruding feature between the recessed regions.