US 12,230,555 B2
Packaged stackable electronic power device for surface mounting and circuit arrangement
Cristiano Gianluca Stella, San Gregorio di Catania (IT); Fabio Vito Coppone, Tremestieri Etneo (IT); and Francesco Salamone, Acireale (IT)
Assigned to STMICROELECTRONICS S.r.l., Agrate Brianza (IT)
Filed by STMICROELECTRONICS S.r.l., Agrate Brianza (IT)
Filed on Dec. 22, 2023, as Appl. No. 18/395,122.
Application 18/395,122 is a continuation of application No. 18/150,511, filed on Jan. 5, 2023, granted, now 11,894,290.
Application 18/150,511 is a continuation of application No. 17/227,030, filed on Apr. 9, 2021, granted, now 11,562,950, issued on Jan. 24, 2023.
Claims priority of application No. 102020000008269 (IT), filed on Apr. 17, 2020.
Prior Publication US 2024/0203837 A1, Jun. 20, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01)
CPC H01L 23/49537 (2013.01) [H01L 23/3114 (2013.01); H01L 23/49513 (2013.01); H01L 23/4952 (2013.01); H01L 23/49541 (2013.01); H01L 23/49562 (2013.01); H01L 23/49568 (2013.01); H01L 23/49575 (2013.01); H01L 24/49 (2013.01); H01L 2924/181 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A device, comprising:
a molding compound including a first surface, a second surface opposite to the first surface, a first sidewall that extends from the first surface to the second surface, and a second sidewall that extends from the first surface to the second surface and is opposite to the first sidewall;
a leadframe including:
a first lead structure including a first outer portion that extends outward from the first sidewall of the molding compound and extends outward from the second surface of the molding compound and a first inner portion that extends into the molding compound;
a second lead structure including a plurality of second outer portions that extend outward from the first sidewall of the molding compound and extend outward from the second surface of the molding compound and a second inner portion coupled to each respective second outer portion of the plurality of second outer portions, the second inner portion extends into the molding compound;
a third lead structure including a third outer portion that extends outward from the second sidewall and extends outward from the second surface of the molding compound and a support portion that is coupled to the third outer portion and extends into the molding compound, wherein the support portion includes a third surface that is exposed from the first surface of the molding compound.