US 12,230,551 B2
Immersion direct cooling modules
Oseob Jeon, Seoul (KR); Youngsun Ko, Incheon (KR); Seungwon Im, Seoul (KR); Jerome Teysseyre, Scottsdale, AZ (US); and Michael J. Seddon, Gilbert, AZ (US)
Assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US)
Filed by SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Phoenix, AZ (US)
Filed on May 23, 2022, as Appl. No. 17/664,549.
Claims priority of provisional application 63/202,557, filed on Jun. 16, 2021.
Prior Publication US 2022/0406684 A1, Dec. 22, 2022
Int. Cl. H05K 7/20 (2006.01); H01L 21/48 (2006.01); H01L 23/44 (2006.01)
CPC H01L 23/44 (2013.01) [H01L 21/4882 (2013.01); H05K 7/20927 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A semiconductor package comprising:
one or more semiconductor die directly coupled to only a direct leadframe attach (DLA) leadframe comprising two or more leads; and
a coating covering the one or more semiconductor die and the DLA leadframe;
wherein when the semiconductor package is coupled into an immersion cooling enclosure, the coating is in contact with a dielectric coolant while the two or more leads extend out of the immersion cooling enclosure.