US 12,230,547 B2
Method of manufacturing a package having an adhesion promoter
Edmund Riedl, Wald (DE); Steffen Jordan, Pielenhofen (DE); Stefan Miethaner, Regensburg (DE); and Stefan Schwab, Singapore (MY)
Assigned to Infineon Technologies AG, Neubiberg (DE)
Filed by Infineon Technologies AG, Neubiberg (DE)
Filed on Apr. 4, 2023, as Appl. No. 18/130,662.
Application 18/130,662 is a division of application No. 16/913,188, filed on Jun. 26, 2020, granted, now 11,652,012.
Claims priority of application No. 102019117534.8 (DE), filed on Jun. 28, 2019.
Prior Publication US 2023/0260860 A1, Aug. 17, 2023
Int. Cl. H01L 23/29 (2006.01); H01L 21/56 (2006.01)
CPC H01L 23/29 (2013.01) [H01L 21/56 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A method of manufacturing a package, the method comprising:
forming an adhesion promoter on at least part of an electronic component, wherein the adhesion promoter is a morphological adhesion promoter comprising a morphological structure having a plurality of openings; and
at least partially encapsulating the electronic component with an inorganic encapsulant with the adhesion promoter in between, wherein the adhesion promoter enhances adhesion between at least part of the electronic component and the encapsulant.