US 12,230,540 B2
Substrate processing system and substrate processing method
Yoshihiro Kawaguchi, Koshi (JP); Hirotoshi Mori, Koshi (JP); and Kazuya Hisano, Koshi (JP)
Assigned to Tokyo Electron Limited, Tokyo (JP)
Appl. No. 17/050,490
Filed by Tokyo Electron Limited, Tokyo (JP)
PCT Filed Apr. 16, 2019, PCT No. PCT/JP2019/016370
§ 371(c)(1), (2) Date Oct. 26, 2020,
PCT Pub. No. WO2019/208338, PCT Pub. Date Oct. 31, 2019.
Claims priority of application No. 2018-086913 (JP), filed on Apr. 27, 2018.
Prior Publication US 2021/0242084 A1, Aug. 5, 2021
Int. Cl. H01L 21/78 (2006.01); B23K 26/00 (2014.01); B23K 103/00 (2006.01); H01L 21/263 (2006.01); H01L 21/304 (2006.01); H01L 21/67 (2006.01); H01L 21/677 (2006.01); H01L 21/687 (2006.01)
CPC H01L 21/78 (2013.01) [B23K 26/0006 (2013.01); H01L 21/263 (2013.01); H01L 21/304 (2013.01); H01L 21/67092 (2013.01); H01L 21/67115 (2013.01); H01L 21/67259 (2013.01); H01L 21/67766 (2013.01); H01L 21/67778 (2013.01); H01L 21/68707 (2013.01); H01L 21/68764 (2013.01); B23K 2103/56 (2018.08)] 15 Claims
OG exemplary drawing
 
1. A substrate processing system, comprising:
a carry-in/out station in which a cassette accommodating therein a processing target substrate is carried in or out;
a pre-alignment apparatus disposed within a processing station and comprising a pre-alignment stage configured to hold the processing target substrate and a detector configured to detect a center position and a crystal orientation of the processing target substrate held by the pre-alignment stage; and
a laser processing apparatus disposed within the processing station and comprising a laser processing stage configured to hold the processing target substrate and a laser processing head configured to radiate and concentrate a laser beam for processing the processing target substrate to the processing target substrate held by the laser processing stage,
wherein the pre-alignment apparatus is disposed above the laser processing apparatus within the same processing station.