US 12,230,529 B2
Substrate holding apparatus, substrate suction determination method, substrate polishing apparatus, substrate polishing method, method of removing liquid from upper surface of wafer to be polished, elastic film for pressing wafer against polishing pad, substrate release method, and constant amount gas supply apparatus
Osamu Nabeya, Tokyo (JP); Satoru Yamaki, Tokyo (JP); and Makoto Fukushima, Tokyo (JP)
Assigned to EBARA CORPORATION, Tokyo (JP)
Filed by EBARA CORPORATION, Tokyo (JP)
Filed on Mar. 26, 2021, as Appl. No. 17/213,748.
Application 17/213,748 is a division of application No. 16/532,843, filed on Aug. 6, 2019, granted, now 10,991,613.
Claims priority of application No. 2018-147661 (JP), filed on Aug. 6, 2018; application No. 2019-032512 (JP), filed on Feb. 26, 2019; and application No. 2019-110491 (JP), filed on Jun. 13, 2019.
Prior Publication US 2021/0217647 A1, Jul. 15, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 21/683 (2006.01); B24B 37/005 (2012.01); B24B 37/04 (2012.01); B24B 37/30 (2012.01); H01L 21/02 (2006.01); H01L 21/306 (2006.01); H01L 21/67 (2006.01)
CPC H01L 21/6838 (2013.01) [B24B 37/005 (2013.01); B24B 37/042 (2013.01); B24B 37/30 (2013.01); H01L 21/0201 (2013.01); H01L 21/67063 (2013.01); H01L 21/67219 (2013.01); H01L 21/30625 (2013.01)] 4 Claims
OG exemplary drawing
 
1. A substrate polishing apparatus comprising;
a top ring main body;
an elastic film comprising a first surface facing the top ring main body and a second surface that is a surface opposite to the first surface and can suck and hold a substrate;
a space between the top ring main body and the first surface of the elastic film that can pressurize and depressurize through a first valve provided on a first line communicating with the space; and
a constant amount gas supply apparatus that can supply a fixed amount of gas to the space through a second valve provided on the first line, wherein
the constant amount gas supply apparatus comprises a cylinder and a piston,
the piston is, under a state where the piston is in contact with an inner surface of the cylinder, can move up and down,
inside of the cylinder is divided into a lower space and an upper space by the piston,
the cylinder is provided with a first opening at a position corresponding to the lower space and second and third openings at positions corresponding to the upper space,
the first opening is connected with a second line connected to the first line through the second valve,
the second opening is connected with a third line,
the third opening is penetrated with a piston rod that coupled to the piston,
the lower space is configured to be opened to atmosphere by opening a third valve provided on the second line opens, and
the upper space is configured to be depressurized and opened to atmosphere through the third line, and
by moving the piston in the cylinder downward, the constant amount gas supply apparatus supplies the fixed amount of gas corresponding to an area of the piston and a stroke of the piston to the space from the cylinder.