US 12,230,528 B2
Wet alignment method for micro-semiconductor chip and display transfer structure
Kyungwook Hwang, Seoul (KR); and Junsik Hwang, Hwaseong-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on May 5, 2023, as Appl. No. 18/312,655.
Application 18/312,655 is a continuation of application No. 17/324,609, filed on May 19, 2021.
Claims priority of application No. 10-2020-0085248 (KR), filed on Jul. 10, 2020; and application No. 10-2021-0011792 (KR), filed on Jan. 27, 2021.
Prior Publication US 2023/0274970 A1, Aug. 31, 2023
Int. Cl. H01L 21/683 (2006.01); H01L 25/075 (2006.01); H01L 33/50 (2010.01); H01L 33/52 (2010.01); H01L 33/62 (2010.01)
CPC H01L 21/6835 (2013.01) [H01L 25/0753 (2013.01); H01L 33/50 (2013.01); H01L 33/52 (2013.01); H01L 33/62 (2013.01); H01L 2221/68309 (2013.01); H01L 2221/68313 (2013.01); H01L 2221/68354 (2013.01); H01L 2221/68368 (2013.01); H01L 2933/0041 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0066 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A micro LED chips transferring method for LED display, the method comprising:
a first transferring process transferring a plurality of micro LED chips onto a transfer substrate having a plurality of grooves, the first transferring process comprises:
supplying liquid to the plurality of grooves in the transfer substrate;
supplying the plurality of micro LED chips onto the transfer substrate; and
aligning the plurality of micro LED chips with the plurality of grooves in the transfer substrate by moving the transfer substrate to enable a liquid absorber to scan across the transfer substrate; and
a second transferring process transferring the plurality of micro LED chips on the transfer substrate onto a display substrate having a display driving circuit.