US 12,230,527 B2
Electrostatic chuck and substrate fixing device
Yusuke Muramatsu, Nagano (JP); Keiichi Takemoto, Nagano (JP); and Yoichi Harayama, Nagano (JP)
Assigned to SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano (JP)
Filed by SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano (JP)
Filed on Mar. 23, 2022, as Appl. No. 17/701,769.
Claims priority of application No. 2021-050503 (JP), filed on Mar. 24, 2021.
Prior Publication US 2022/0310434 A1, Sep. 29, 2022
Int. Cl. H01L 21/683 (2006.01); H01L 21/67 (2006.01)
CPC H01L 21/6833 (2013.01) [H01L 21/67103 (2013.01)] 14 Claims
OG exemplary drawing
 
1. An electrostatic chuck comprising:
a base body formed of a dielectric substance, the base body comprising: a mounting face on which an object to be adsorbed is to be mounted; and a back face that is opposite to the mounting face;
an insulating layer that is formed on the back face;
a heating element that is built in the insulating layer and configured to generate heat;
a plurality of thermal diffusion layers built in the base body and disposed on one another in a thickness direction of the base body, the plurality of thermal diffusion layers being configured to diffuse the heat generated by the heating element, wherein the plurality of thermal diffusion layers are formed of a material higher in thermal conductivity than the base body;
an electrode that is built in the base body; and
a vertical wiring that is built in the base body to be electrically connected to the electrode,
wherein
the vertical wiring comprises a plurality of pads and vias disposed on each other alternately,
the vertical wiring is built in the base body so as to be spaced from the plurality of thermal diffusion layers,
a position of each of the plurality of pads is the same as a position of a corresponding one of the plurality of thermal diffusion layers in the thickness direction, and
each of the plurality of pads is built in the base body so as to be spaced from the corresponding one of the plurality of thermal diffusion layers.