US 12,230,525 B2
Micro-semiconductor chip wetting alignment apparatus
Kyungwook Hwang, Seoul (KR); Hyunjoon Kim, Seoul (KR); Joonyong Park, Suwon-si (KR); Seogwoo Hong, Yongin-si (KR); and Junsik Hwang, Hwaseong-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Jul. 22, 2021, as Appl. No. 17/383,012.
Claims priority of provisional application 63/124,425, filed on Dec. 11, 2020.
Claims priority of application No. 10-2021-0019353 (KR), filed on Feb. 10, 2021.
Prior Publication US 2022/0189810 A1, Jun. 16, 2022
Int. Cl. H01L 21/68 (2006.01); H01L 21/683 (2006.01); H01L 25/075 (2006.01); H01L 33/00 (2010.01)
CPC H01L 21/681 (2013.01) [H01L 21/6835 (2013.01); H01L 25/0753 (2013.01); H01L 33/005 (2013.01)] 27 Claims
OG exemplary drawing
 
1. A micro-semiconductor chip wet alignment apparatus comprising:
a semiconductor chip wet supply module configured to supply a plurality of micro-semiconductor chips and a liquid onto a transfer substrate so that the plurality of micro-semiconductor chips are movable along with the liquid on the transfer substrate; and
a chip alignment module comprising an absorber configured to:
contact a surface of the transfer substrate and move along the surface of the transfer substrate to align the plurality of micro-semiconductor chips in a plurality of grooves of the transfer substrate, and
absorb the liquid on the transfer substrate while in contact with the surface of the transfer substrate,
wherein the absorber comprises a porous material configured to absorb and retain the liquid from the transfer substrate.