US 12,230,521 B2
Method for non-contact low substrate temperature measurement
Kim Ramkumar Vellore, San Jose, CA (US); Leonid M. Tertitski, Vista, CA (US); and Matthew D. Scotney-Castle, Morgan Hill, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on May 28, 2020, as Appl. No. 16/885,909.
Claims priority of provisional application 62/856,496, filed on Jun. 3, 2019.
Prior Publication US 2020/0381278 A1, Dec. 3, 2020
Int. Cl. H01L 21/67 (2006.01); G01J 5/00 (2022.01); G01J 5/48 (2022.01); H04N 5/33 (2023.01)
CPC H01L 21/67248 (2013.01) [G01J 5/00 (2013.01); H04N 5/33 (2013.01); G01J 2005/0077 (2013.01); G01J 5/485 (2022.01)] 20 Claims
OG exemplary drawing
 
12. A factory interface configured to measure a temperature of a substrate, comprising:
a body;
a factory interface robot disposed in the body and having an end effector for transferring the substrate between one or more load lock chambers and the factory interface, the factory interface robot configured to position the substrate in a prescribed location on a substrate support of the factory interface; and
an infrared camera positioned in the factory interface and radially aligned with the prescribed location; and
a controller configured to:
trigger the infrared camera oriented to view one side of a lateral edge surface of the substrate to obtain a first infrared image of the substrate while the substrate is positioned in the prescribed location, wherein the infrared camera is oriented to view the lateral edge surface of the substrate along a radial axis of the substrate; and
processing data from the first infrared image to obtain an absolute temperature profile of the substrate.