US 12,230,519 B2
Method and apparatus for multiple axis direct transfers of semiconductor devices
Sean Kupcow, Greenacres, WA (US); Nicholas Steven Busch, Spokane, WA (US); and Justin Wendt, Post Falls, ID (US)
Assigned to COWLES SEMI, LLC, Spokane, WA (US)
Filed by Cowles Semi, LLC, Spokane, WA (US)
Filed on May 23, 2022, as Appl. No. 17/751,444.
Prior Publication US 2023/0377917 A1, Nov. 23, 2023
Int. Cl. H01L 21/67 (2006.01)
CPC H01L 21/67132 (2013.01) 6 Claims
OG exemplary drawing
 
1. An apparatus, comprising:
a transfer mechanism configured to transfer an electrically-actuatable element directly from a wafer tape to a transfer location on a circuit trace, the transfer mechanism including:
a needle pivotably coupled to a frame of the transfer mechanism at a pivot location;
a first actuator configured to pivot the needle about the pivot location to align an axis of the needle with the transfer location;
a second actuator configured to actuate the needle in a direction along the axis to press the electrically-actuatable element into contact with the circuit trace at the transfer location; and
a controller configured to at least:
determine an electrically actuatable element location on the wafer tape;
determine an orientation for the needle based at least in part on the electrically-actuatable element location and the transfer location; and
cause the first actuator to pivot the needle based on the orientation.