US 12,230,513 B2
Cross-wafer RDLs in constructed wafers
Chen-Hua Yu, Hsinchu (TW); and Tin-Hao Kuo, Hsinchu (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD, Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Jan. 11, 2024, as Appl. No. 18/410,365.
Application 18/410,365 is a continuation of application No. 17/660,501, filed on Apr. 25, 2022, granted, now 11,908,706.
Application 17/660,501 is a continuation of application No. 17/087,147, filed on Nov. 2, 2020, granted, now 11,315,805, issued on Apr. 26, 2022.
Application 17/087,147 is a continuation of application No. 16/273,836, filed on Feb. 12, 2019, granted, now 10,825,696, issued on Nov. 3, 2020.
Claims priority of provisional application 62/693,171, filed on Jul. 2, 2018.
Prior Publication US 2024/0145257 A1, May 2, 2024
Int. Cl. H01L 21/56 (2006.01); H01L 21/768 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/522 (2006.01); H01L 23/538 (2006.01); H01L 25/18 (2023.01)
CPC H01L 21/565 (2013.01) [H01L 21/76802 (2013.01); H01L 23/3121 (2013.01); H01L 23/5226 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01); H01L 24/09 (2013.01); H01L 24/17 (2013.01); H01L 25/18 (2013.01); H01L 2224/0231 (2013.01); H01L 2224/02375 (2013.01); H01L 2224/02381 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A structure comprising:
a reconstructed wafer comprising:
a plurality of device dies allocated as a plurality of groups, wherein the plurality of groups are identical to each other, and wherein the plurality of groups comprise a first device die group and a second device die group;
an encapsulant encapsulating the plurality of device dies therein; and
a plurality of redistribution lines over and electrically inter-coupling the first device die group and the second device die group, wherein the first device die group is closer to a first corner of the reconstructed wafer than all other groups in the plurality of groups, and the second device die group is closer to a second corner of the reconstructed wafer than all other groups in the plurality of groups; and
a thermal module attached to the reconstructed wafer.