US 12,230,512 B2
Resin molded product production method, molding die, and resin molding apparatus
Ryota Nakatsukasa, Kyoto (JP)
Assigned to TOWA CORPORATION, Kyoto (JP)
Filed by TOWA CORPORATION, Kyoto (JP)
Filed on Feb. 11, 2022, as Appl. No. 17/669,679.
Claims priority of application No. 2021-023804 (JP), filed on Feb. 17, 2021.
Prior Publication US 2022/0262650 A1, Aug. 18, 2022
Int. Cl. H01L 21/56 (2006.01); B29C 45/14 (2006.01); H01L 21/67 (2006.01); B29C 45/02 (2006.01); B29C 45/17 (2006.01); B29L 31/34 (2006.01)
CPC H01L 21/565 (2013.01) [B29C 45/14336 (2013.01); B29C 45/14655 (2013.01); H01L 21/56 (2013.01); H01L 21/568 (2013.01); H01L 21/67126 (2013.01); B29C 45/02 (2013.01); B29C 45/1769 (2013.01); B29L 2031/3406 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A method for producing a resin molded product obtained by subjecting an object to be molded being a chip temporarily bonded to a carrier via a temporary bonding sheet to transfer molding, comprising the steps of:
resin-molding the object to be molded by transfer molding using a molding die, and
peeling the temporary bonding sheet from the resin molded product after the resin-molding, wherein
the resin-molding is performed in a state where a gap is formed so that the temporary bonding sheet disposed in the molding die and a surface facing the temporary bonding sheet on a side where the chip is temporarily bonded do not come into contact with each other,
the temporary bonding sheet is a temporary bonding sheet that is peelable from the resin molded product by heating, and
the peeling is performed by heating the temporary bonding sheet and the resin molded product to a temperature higher than that in the resin-molding.