US 12,230,511 B2
Method of manufacturing semiconductor devices and corresponding device
Fulvio Vittorio Fontana, Monza (IT); and Marco Rovitto, Milan (IT)
Assigned to STMicroelectronics S.r.l., Agrate Brianza (IT)
Filed by STMicroelectronics S.r.l., Agrate Brianza (IT)
Filed on Aug. 10, 2021, as Appl. No. 17/398,710.
Claims priority of application No. 102020000020386 (IT), filed on Aug. 24, 2020.
Prior Publication US 2022/0059368 A1, Feb. 24, 2022
Int. Cl. H01L 21/48 (2006.01); H01L 21/67 (2006.01); H01L 23/495 (2006.01)
CPC H01L 21/4867 (2013.01) [H01L 21/6715 (2013.01); H01L 23/49513 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A method for mounting at least one semiconductor chip or die to a chip mounting substrate, comprising:
holding the at least one semiconductor chip or die within a chip retaining formation provided by a chip holding device that includes a periphery having a lower face that surrounds the chip retaining formation;
arranging said chip holding device to face a chip attachment location of the chip mounting substrate, wherein arranging places the lower face at the periphery of the chip holding device in contact with the chip mounting substrate and forms a cavity between the at least one semiconductor chip or die and the chip attachment location; and
dispensing a chip attachment material into said cavity through a duct passing through the chip holding device and having an end opening on the lower face of the chip holding device, wherein said chip attachment material attaches the at least one semiconductor chip or die onto said chip mounting substrate at said chip attachment location.