US 12,230,508 B1
Substrate structuring method
Pierre Montmeat, Grenoble (FR); and Franck Fournel, Grenoble (FR)
Assigned to Commissariat à l'Énergie Atomique et aux Énergies Alternatives, Paris (FR)
Filed by Commissariat à l'Énergie Atomique et aux Énergies Alternatives, Paris (FR)
Filed on Aug. 15, 2024, as Appl. No. 18/805,861.
Int. Cl. H01L 21/321 (2006.01); H01L 21/311 (2006.01); H01L 21/3213 (2006.01)
CPC H01L 21/32139 (2013.01) [H01L 21/31144 (2013.01)] 11 Claims
OG exemplary drawing
 
1. Method of forming patterns on a substrate comprising the following steps:
a) Bonding a handle substrate to a substrate of interest, the handle substrate comprising a base and raised elements covering the base, the substrate of interest comprising a support substrate covered with a thin film, the thin film comprising a material sensitive to an etchant, whereby the thin film comprises first areas not covered with the raised elements and second areas covered with the raised elements,
b) Forming a hydrophobic layer on the first areas of the thin film, for example by placing into contact the assembly obtained at step a) with a solution comprising a hydrophobic compound,
c) Separating the handle substrate from the substrate of interest,
d) Placing into contact the substrate of interest with an aqueous solution comprising the etchant, whereby the material sensitive to the etchant present in the second areas of the thin film is etched and raised patterns are formed.