US 12,230,483 B2
Deposition method and processing apparatus
Takehiro Tanikawa, Miyagi (JP)
Assigned to Tokyo Electron Limited, Tokyo (JP)
Filed by Tokyo Electron Limited, Tokyo (JP)
Filed on Mar. 6, 2023, as Appl. No. 18/178,801.
Claims priority of application No. 2022-034486 (JP), filed on Mar. 7, 2022.
Prior Publication US 2023/0282457 A1, Sep. 7, 2023
Int. Cl. H01J 37/32 (2006.01)
CPC H01J 37/32715 (2013.01) [H01J 37/32568 (2013.01); H01J 2237/2007 (2013.01); H01J 2237/334 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A stage comprising:
a base;
an electrostatic chuck provided on the base and including N electrodes in the electrostatic chuck, where N is an integer greater than or equal to two; and
a power supply configured to apply voltages of different N-phases to the respective N electrodes, each of the voltages having a positive level and a negative level that periodically alternate,
wherein a center line of an electrode gap that is provided between adjacent electrodes, among the N electrodes, is configured to satisfy the relation of x=x=r·cos(θ+2π(n−1)/N) and y=r·sin(θ+2π(n−1)/N), and wherein
x and y are coordinates of the center line,
θ is a rotation angle of a polar coordinate system in which the center of the electrostatic chuck is an original point, and
n is a parameter that specifies a range of values of 1 to N.