US 12,230,479 B2
Processing chamber with multiple plasma units
Kazuya Daito, Milipitas, CA (US); Yi Xu, San Jose, CA (US); Yu Lei, Belmont, CA (US); Takashi Kuratomi, San Jose, CA (US); Jallepally Ravi, San Ramon, CA (US); Pingyan Lei, San Jose, CA (US); and Dien-Yeh Wu, San Jose, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Mar. 8, 2024, as Appl. No. 18/599,767.
Application 18/599,767 is a division of application No. 17/844,245, filed on Jun. 20, 2022, granted, now 11,955,319.
Application 17/844,245 is a division of application No. 17/101,074, filed on Nov. 23, 2020, abandoned.
Claims priority of provisional application 62/960,293, filed on Jan. 13, 2020.
Claims priority of provisional application 62/941,148, filed on Nov. 27, 2019.
Prior Publication US 2024/0249918 A1, Jul. 25, 2024
Int. Cl. C23C 16/50 (2006.01); C23C 16/455 (2006.01); H01J 37/32 (2006.01); H01L 21/67 (2006.01); H05H 1/46 (2006.01)
CPC H01J 37/32357 (2013.01) [C23C 16/45536 (2013.01); C23C 16/50 (2013.01); H01J 37/32422 (2013.01); H01L 21/67028 (2013.01); H01L 21/67069 (2013.01); H05H 1/4652 (2021.05); H01J 2237/327 (2013.01); H01J 2237/332 (2013.01); H01J 2237/335 (2013.01)] 5 Claims
OG exemplary drawing
 
1. A non-transitory computer readable medium including instructions, that, when executed by a controller of a processing chamber, causes the processing chamber to perform operations of:
exposing a substrate to a remote plasma that remotely impacts the substrate; and
exposing the substrate to a direct plasma that directly impacts the substrate,
wherein the direct plasma is generated first between a pedestal electrode and an ion filter and the remote plasma is generated between the ion filter and one or more of an ICP coil and a top electrode after the direct plasma is generated.