US 12,230,454 B2
Method of forming a polymer dispersion
Victor Andoralov, Gränna (SE); Vania Pais, Évora (PT); Débora Sá, Évora (PT); and Rui A. Monteiro, Évora (PT)
Assigned to KEMET Electronics Corporation, Fort Lauderdale, FL (US)
Filed by KEMET Electronics Corporation, Fort Lauderdale, FL (US)
Filed on Feb. 20, 2024, as Appl. No. 18/581,520.
Application 18/581,520 is a division of application No. 17/948,437, filed on Sep. 20, 2022, granted, now 11,935,705.
Claims priority of provisional application 63/249,225, filed on Sep. 28, 2021.
Prior Publication US 2024/0203666 A1, Jun. 20, 2024
Int. Cl. H01G 9/028 (2006.01); H01G 9/07 (2006.01)
CPC H01G 9/028 (2013.01) [H01G 9/07 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A method of forming a polymer dispersion comprising:
providing a conductive polymer dispersion comprising a conductive polymer in a bipolaron state;
subjecting said conductive polymer dispersion to high-pressure homogenization thereby converting said conductive polymer into first polymer particles having a positive Z-potential and second polymer particles having a negative Z-potential.