US 12,230,445 B2
Multilayer electronic component
Bon Hyeong Koo, Suwon-si (KR); Seok Hyun Yoon, Suwon-si (KR); In Ho Jeon, Suwon-si (KR); Byung Kil Yun, Suwon-si (KR); Se Yong Kim, Suwon-si (KR); Min Jung Jang, Suwon-si (KR); and Geon Hoi Kim, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Apr. 19, 2023, as Appl. No. 18/136,418.
Claims priority of application No. 10-2023-0003409 (KR), filed on Jan. 10, 2023.
Prior Publication US 2024/0234032 A1, Jul. 11, 2024
Int. Cl. H01G 4/12 (2006.01); C04B 35/626 (2006.01); H01G 4/008 (2006.01); H01G 4/012 (2006.01); H01G 4/30 (2006.01)
CPC H01G 4/1227 (2013.01) [C04B 35/6262 (2013.01); H01G 4/008 (2013.01); H01G 4/012 (2013.01); H01G 4/30 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A multilayer electronic component, comprising:
a body including a dielectric layer and internal electrodes; and
an external electrode disposed on the body,
wherein the dielectric layer includes dielectric grains,
wherein at least one of the dielectric grains includes a twin boundary, and
wherein the dielectric layer includes a region in which a sum of lengths of twin boundaries included in a 2 μm×2 μm region is 1.49 μm or more.