US 12,230,443 B2
Multilayer electronic component
Min Jung Cho, Suwon-si (KR); Byung Kun Kim, Suwon-si (KR); Yu Hong Oh, Suwon-si (KR); and Chang Hak Choi, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Jun. 15, 2023, as Appl. No. 18/210,365.
Application 18/210,365 is a continuation of application No. 17/379,465, filed on Jul. 19, 2021, granted, now 11,715,595.
Claims priority of application No. 10-2020-0155481 (KR), filed on Nov. 19, 2020.
Prior Publication US 2023/0326673 A1, Oct. 12, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01G 4/00 (2006.01); H01G 4/008 (2006.01); H01G 4/248 (2006.01); H01G 4/30 (2006.01)
CPC H01G 4/008 (2013.01) [H01G 4/248 (2013.01); H01G 4/30 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A multilayer electronic component comprising:
a body including dielectric layers and internal electrodes alternately disposed with the dielectric layers; and
external electrodes disposed on the body and connected to the internal electrodes,
wherein one of the internal electrodes includes Tb, and a ratio of a length of an actual internal electrode to a total length of the one of the internal electrodes is defined as internal electrode connectivity, and the internal electrode connectivity of the one of the internal electrodes is 86% or more and 93% or less.