US 12,230,434 B2
Electronic component
Kyosuke Inui, Tokyo (JP); Toru Tonogai, Tokyo (JP); and Yuichi Oyanagi, Tokyo (JP)
Assigned to TDK CORPORATION, Tokyo (JP)
Filed by TDK CORPORATION, Tokyo (JP)
Filed on May 14, 2021, as Appl. No. 17/320,380.
Claims priority of application No. 2020-085092 (JP), filed on May 14, 2020.
Prior Publication US 2021/0358682 A1, Nov. 18, 2021
Int. Cl. H01F 17/04 (2006.01); H01F 27/29 (2006.01); H01F 27/28 (2006.01); H01F 41/06 (2016.01)
CPC H01F 27/29 (2013.01) [H01F 27/2823 (2013.01); H01F 41/06 (2013.01)] 6 Claims
OG exemplary drawing
 
1. An electronic component comprising:
an element body containing metal particles and a resin; and
a resin electrode layer formed on an electrode facing portion which is a part of an outer surface of the element body, wherein:
the resin electrode layer contains a resin component and a conductor powder,
the electrode facing portion includes an exposed portion formed by removing the resin on an outermost surface of the element body to expose a part of an outer periphery of the metal particles located on the outermost surface,
the electrode facing portion further includes a leadout electrode portion where a part of a conductor located inside the element body is exposed and a non-exposed portion where the resin is not removed from the outermost surface of the element body,
the exposed portion is located at a periphery of the leadout electrode portion in a plane direction of the electrode facing portion,
the non-exposed portion is located on an outer periphery of the exposed portion,
the metal particles located at the non-exposed portion are covered with the resin and the exposed portion has surface roughness that is rougher in comparison to a surface of the non-exposed portion, and
the resin electrode layer is joined to both the exposed portion and the non-exposed portion of the electrode facing portion.