CPC H01F 27/26 (2013.01) [H01F 27/425 (2013.01); H01L 21/76871 (2013.01); H01L 23/645 (2013.01); H01F 27/245 (2013.01); H01F 27/25 (2013.01)] | 9 Claims |
1. An electronic package for use as an integrated voltage regulator with a microelectronic system, the electronic package comprising:
a substrate defining at least one layer having one or more of electrically conductive elements separated by a dielectric material;
a first magnetic foil having ferromagnetic alloy ribbons, the first magnetic foil embedded within the substrate adjacent to the one or more of electrically conductive elements, wherein the first magnetic foil is positioned to interface with and be spaced from a first side of the one or more of electrically conductive elements such that the first magnetic foil interfaces with and is spaced from the first side of the one or more of electrically conductive elements, and wherein the dielectric material comprises a single continuous dielectric layer from a top of the first magnetic foil to a bottom of the one or more of electrically conductive elements; and
a second magnetic foil that is positioned on a second side of the one or more of electrically conductive elements such that the second magnetic foil interfaces with and is spaced from the second side of the one or more of electrically conductive elements, wherein the second magnetic foil is spaced apart and isolated from the first magnetic foil.
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