US 12,230,424 B1
Bond wire payoff system and method
Jeremy T. Smith, The Colony, TX (US)
Assigned to Encore Wire Corporation, McKinney, TX (US)
Filed by Encore Wire Corporation, McKinney, TX (US)
Filed on Apr. 27, 2022, as Appl. No. 17/730,412.
Claims priority of provisional application 63/180,314, filed on Apr. 27, 2021.
Int. Cl. H01B 7/32 (2006.01); G01R 31/59 (2020.01); H01B 1/02 (2006.01)
CPC H01B 7/32 (2013.01) [G01R 31/59 (2020.01); H01B 1/02 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A bond wire payoff system, the bond wire payoff system comprising:
a bond wire;
a bond wire payoff assembly, wherein the bond wire passes through the bond wire payoff assembly;
a sensor assembly connected to the bond wire payoff assembly, wherein the bond wire passes through the sensor assembly and wherein the sensor assembly comprises a rotatable sensor shaft and a rotatable sensor sheave connected to the rotatable sensor shaft;
a controller coupled with the sensor assembly, wherein the controller detects a break in the bond wire; and
an alarm coupled to the controller, wherein the alarm is triggered when a break in the bond wire is detected by the controller.