US 12,230,338 B2
Semiconductor memory devices with diode-connected MOS
Perng-Fei Yuh, Hsinchu (TW); Tung-Cheng Chang, Xihu Township (TW); Gu-Huan Li, Zhubei (TW); Chia-En Huang, Xinfeng Township (TW); Chun-Ying Lee, Hsinchu (TW); and Yih Wang, Hsinchu (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Apr. 4, 2024, as Appl. No. 18/626,971.
Application 18/328,110 is a division of application No. 17/484,730, filed on Sep. 24, 2021, granted, now 11,688,481, issued on Jun. 27, 2023.
Application 18/626,971 is a continuation of application No. 18/328,110, filed on Jun. 2, 2023, granted, now 11,955,191.
Claims priority of provisional application 63/172,388, filed on Apr. 8, 2021.
Prior Publication US 2024/0249784 A1, Jul. 25, 2024
Int. Cl. G11C 17/16 (2006.01); G11C 17/18 (2006.01); H10B 20/25 (2023.01)
CPC G11C 17/16 (2013.01) [G11C 17/18 (2013.01); H10B 20/25 (2023.02)] 20 Claims
OG exemplary drawing
 
1. A memory device, comprising:
a plurality of memory cells, each of the plurality of memory cells is operatively coupled to a word line, a gate control line, a bit line, and a control line;
wherein each of the plurality of memory cells comprises a first transistor, a second transistor, a third transistor, a diode-connected transistor, and a capacitor coupled to one another in series; and
wherein the capacitor is coupled between the bit line and a common node between the second transistor and the third transistor.