US 12,230,323 B2
Memory cell array circuit and method of forming the same
Chin-I Su, Hsinchu (TW); Chung-Cheng Chou, Hsinchu (TW); Yu-Der Chih, Hsinchu (TW); and Zheng-Jun Lin, Hsinchu (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed by TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed on Apr. 20, 2023, as Appl. No. 18/304,297.
Application 18/304,297 is a continuation of application No. 17/103,239, filed on Nov. 24, 2020, granted, now 11,636,896.
Claims priority of provisional application 63/045,961, filed on Jun. 30, 2020.
Prior Publication US 2023/0253041 A1, Aug. 10, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. G11C 13/00 (2006.01)
CPC G11C 13/0069 (2013.01) [G11C 13/0028 (2013.01); G11C 13/0038 (2013.01); G11C 2013/0078 (2013.01); G11C 2213/79 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A memory circuit comprising:
a first driver circuit;
a memory cell array including a first column of memory cells;
a first transistor coupled between the first driver circuit and the memory cell array, the first transistor is configured to receive a first select signal;
a second driver circuit;
a first column of tracking cells configured to track a leakage current of the first column of memory cells, and coupled between a first conductive line and a second conductive line, the first conductive line being coupled to the second driver circuit; and
a header circuit coupled to the first driver circuit and the second driver circuit.