US 12,229,614 B2
Card device and method for manufacturing card device
Hui-Ching Yang, Miao-Li County (TW); Yu-Tsung Liu, Miao-Li County (TW); and Te-Yu Lee, Miao-Li County (TW)
Assigned to InnoLux Corporation, Miao-Li County (TW)
Filed by InnoLux Corporation, Miao-Li County (TW)
Filed on Mar. 15, 2023, as Appl. No. 18/121,600.
Claims priority of application No. 202210359219.5 (CN), filed on Apr. 6, 2022.
Prior Publication US 2023/0325624 A1, Oct. 12, 2023
Int. Cl. G06K 19/07 (2006.01); G06K 19/077 (2006.01)
CPC G06K 19/077 (2013.01) [G06K 19/0717 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A card device, comprising:
a first substrate;
a circuit board disposed on the first substrate, wherein the circuit board comprises an accommodating recess;
a sensing module disposed in the accommodating recess, wherein the sensing module comprises a sensing unit and a protective layer formed on a surface of the sensing unit, and the sensing unit is electrically connected to the circuit board;
a second substrate disposed on the circuit board, wherein the second substrate comprises an opening, and the opening exposes the protective layer; and
a bezel disposed between the accommodating recess and the sensing module, wherein the bezel exposes the protective layer.