US 12,229,613 B2
Anti-tamper radio frequency identification transponder
Pradit Tosapong, Hong Kong (HK)
Assigned to STAR SYSTEMS INTERNATIONAL LIMITED, Hong Kong (HK)
Appl. No. 18/261,117
Filed by STAR SYSTEMS INTERNATIONAL LIMITED, Hong Kong (HK)
PCT Filed Feb. 28, 2022, PCT No. PCT/CN2022/078333
§ 371(c)(1), (2) Date Jul. 12, 2023,
PCT Pub. No. WO2023/159579, PCT Pub. Date Aug. 31, 2023.
Prior Publication US 2024/0370687 A1, Nov. 7, 2024
Int. Cl. G06K 19/073 (2006.01)
CPC G06K 19/0739 (2013.01) 9 Claims
OG exemplary drawing
 
1. An anti-tamper passive Radio Frequency Identification (RFID) transponder for attachment to a surface that is at least partially translucent, comprising:
an RFID inlay, comprising an RFID Integrated Circuit (IC) chip connecting to an RFID antenna; and
a first opaque label on a first side of the RFID inlay;
wherein when attached to the surface, the first opaque label is between the RFID inlay and the surface, and the first opaque label is viewable through the surface while preventing view of the RFID inlay through the surface;
wherein the first opaque label is with pre-cut lines; and
wherein the anti-tamper passive RFID transponder and the pre-cut lines are configured and arranged such that when an attempted removal of the anti-tamper passive RFID transponder from the surface is performed, after being attached to the surface, the RFID antenna is damaged and the RFID inlay is rendered inoperable,
wherein the anti-tamper passive RFID transponder further comprises at least one of:
a Break-On-Removal (BOR) layer, wherein the BOR layer is configured and arranged to break the RFID antenna, during the attempted removal, to render the RFID inlay inoperable; or
a Non-Removable Non-Transferable (NRNT) layer, wherein the NRNT layer is configured and arranged to break the RFID antenna, during the attempted removal, to render the RFID inlay inoperable, by having pre-cut lines across at least a part of the RFID antenna.