US 12,228,971 B2
Electronic book
Shunpei Yamazaki, Tokyo (JP); Jun Koyama, Kanagawa (JP); Yasuyuki Arai, Kanagawa (JP); Ikuko Kawamata, Kanagawa (JP); Atsushi Miyaguchi, Kanagawa (JP); and Yoshitaka Moriya, Kanagawa (JP)
Assigned to Semiconductor Energy Laboratory Co., Ltd., (JP)
Filed by Semiconductor Energy Laboratory Co., Ltd., Kanagawa-ken (JP)
Filed on Oct. 27, 2023, as Appl. No. 18/384,474.
Application 18/384,474 is a continuation of application No. 17/993,181, filed on Nov. 23, 2022, granted, now 11,803,213.
Application 17/993,181 is a continuation of application No. 17/140,473, filed on Jan. 4, 2021, granted, now 11,513,562, issued on Nov. 29, 2022.
Application 17/140,473 is a continuation of application No. 16/002,303, filed on Jun. 7, 2018, granted, now 10,915,145, issued on Feb. 9, 2021.
Application 16/002,303 is a continuation of application No. 15/168,674, filed on May 31, 2016, granted, now 9,996,115, issued on Jun. 12, 2018.
Application 15/168,674 is a continuation of application No. 14/727,113, filed on Jun. 1, 2015, granted, now 9,361,853, issued on Jun. 7, 2016.
Application 14/727,113 is a continuation of application No. 13/864,752, filed on Apr. 17, 2013, granted, now 9,047,799, issued on Jun. 2, 2015.
Application 13/864,752 is a continuation of application No. 12/769,266, filed on Apr. 28, 2010, granted, now 8,427,420, issued on Apr. 23, 2013.
Claims priority of application No. 2009-112375 (JP), filed on May 2, 2009.
Prior Publication US 2024/0061471 A1, Feb. 22, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. G06F 1/16 (2006.01); G02F 1/1333 (2006.01); G02F 1/1345 (2006.01); G02F 1/1368 (2006.01); G06F 3/147 (2006.01); G09G 3/00 (2006.01); G09G 3/20 (2006.01); G09G 3/3225 (2016.01); G09G 3/36 (2006.01); G09G 5/00 (2006.01); G06F 3/14 (2006.01); G09G 3/34 (2006.01)
CPC G06F 1/1652 (2013.01) [G02F 1/133305 (2013.01); G02F 1/13452 (2013.01); G02F 1/1368 (2013.01); G06F 1/1616 (2013.01); G06F 1/1635 (2013.01); G06F 1/1643 (2013.01); G06F 1/1647 (2013.01); G06F 3/147 (2013.01); G09G 3/035 (2020.08); G09G 3/20 (2013.01); G09G 3/2096 (2013.01); G09G 3/3225 (2013.01); G09G 3/3648 (2013.01); G09G 5/003 (2013.01); G06F 3/1423 (2013.01); G09G 3/344 (2013.01); G09G 2300/08 (2013.01); G09G 2310/0218 (2013.01); G09G 2310/0267 (2013.01); G09G 2310/0275 (2013.01); G09G 2310/0281 (2013.01); G09G 2330/02 (2013.01); G09G 2330/021 (2013.01); G09G 2360/144 (2013.01); G09G 2380/14 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A display device comprising:
a first resin layer;
a second resin layer;
a display portion between the first resin layer and the second resin layer;
a scan line driver circuit between the first resin layer and the second resin layer;
a connection terminal electrode over the first resin layer;
an FPC electrically connected to the connection terminal electrode;
a first plate configured to support the first resin layer; and
a second plate configured to support the first resin layer,
wherein the display device is an active matrix display device,
wherein the first resin layer is over the first plate and the second plate,
wherein the second resin layer is over the first resin layer,
wherein the first plate and the second plate are apart from each other,
wherein the first resin layer comprises a first region, a second region, a third region, a fourth region, and a fifth region,
wherein the first region and the connection terminal electrode overlap each other,
wherein the third region and the first plate overlap each other,
wherein the third region and the display portion overlap each other,
wherein the second region is between the first region and the third region,
wherein the fourth region and the display portion overlap each other,
wherein the fifth region and the second plate overlap each other,
wherein the fifth region and the display portion overlap each other,
wherein the fourth region is between the third region and the fifth region,
wherein the second region and the fourth region are configured to be bent, and
wherein the scan line driver circuit does not overlap with the first region in a state where the first resin layer is not bent.