US 12,228,967 B2
Electronic device including photosensor module
Seonho Han, Suwon-si (KR); Donghoo Jang, Suwon-si (KR); Jongah Kim, Suwon-si (KR); Shinhun Moon, Suwon-si (KR); and Hyungsoo Park, Suwon-si (KR)
Assigned to Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Mar. 2, 2022, as Appl. No. 17/685,228.
Application 17/685,228 is a continuation of application No. PCT/KR2020/011703, filed on Sep. 1, 2020.
Claims priority of application No. 10-2019-0110274 (KR), filed on Sep. 5, 2019.
Prior Publication US 2022/0187869 A1, Jun. 16, 2022
Int. Cl. G06F 1/16 (2006.01); G04G 9/00 (2006.01); G04G 17/04 (2006.01)
CPC G06F 1/163 (2013.01) [G04G 9/007 (2013.01); G04G 17/045 (2013.01); H05K 2201/055 (2013.01); H05K 2201/10151 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic device comprising:
a housing including a front plate facing a front surface and a rear plate facing a rear surface;
a display assembly comprising a display visible through at least a part of the front plate;
wherein the display assembly includes:
an upper portion;
a lower portion overlapping at least a partial area of the upper portion and including a first opening; and
a flexible circuit board overlapping at least a partial area of the lower portion and including a first surface facing the lower portion, a second surface opposite to the first surface, and a second opening corresponding to at least a part of the first opening,
wherein the lower portion is disposed between the upper portion and the flexible circuit board; and
a photosensor module including a sensing unit comprising a sensor corresponding to at least a part of the second opening and a plurality of pads disposed adjacent to the sensing unit and electrically coupled to the flexible circuit board, wherein the plurality of pads are disposed between the sensing unit and the second surface of the flexible circuit board to space the sensing unit apart from the second surface of the flexible circuit board,
wherein the photosensor module is disposed completely under the second surface of the flexible circuit board and configured to detect at least a part of light sequentially passing through the upper portion, the first opening of the lower portion and the second opening of the flexible circuit board from an outside of the electronic device,
wherein the flexible circuit board includes a base, first bent part extending from the base in a first direction and towards the front surface and disposed on the second surface around the photosensor module, and a second bent part extending from the base in a second direction that is perpendicular to the first direction and towards the front surface, and at least one of the first bent part and the second bent part connected to the upper portion, and
wherein the first bent part is coupled to a groove included on the second surface and adjacent to an edge of the flexible circuit board, the first bent part is curved around the edge of the flexible circuit board towards the front surface, and the first bent part is bent in a U-shape that at least partially surrounds the photosensor module when viewed from below the rear plate.