US 12,228,965 B2
Flexible display module and electronic device including the same
Jonghwan Choi, Suwon-si (KR)
Assigned to Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Dec. 27, 2023, as Appl. No. 18/397,108.
Application 18/397,108 is a continuation of application No. 18/177,319, filed on Mar. 2, 2023, granted, now 11,886,219.
Application 18/177,319 is a continuation of application No. 16/724,749, filed on Dec. 23, 2019, granted, now 11,599,143, issued on Mar. 7, 2023.
Claims priority of application No. 10-2018-0168215 (KR), filed on Dec. 24, 2018; and application No. 10-2019-0018900 (KR), filed on Feb. 19, 2019.
Prior Publication US 2024/0126324 A1, Apr. 18, 2024
Int. Cl. G06F 1/00 (2006.01); G06F 1/16 (2006.01); H04M 1/02 (2006.01); H05K 1/18 (2006.01)
CPC G06F 1/1616 (2013.01) [G06F 1/1652 (2013.01); H04M 1/0268 (2013.01); H05K 1/189 (2013.01)] 12 Claims
OG exemplary drawing
 
1. An electronic device comprising:
a flexible display;
a plurality of plates disposed under the flexible display, each of the plates being disposed to be separated from each other with respect to a folding area of the electronic device,
a plurality of support layers supporting the flexible display, each of the support layers being disposed to be separated from each other with respect to the folding area of the electronic device, wherein a first support layer of the plurality of support layers is disposed between a first plate of the plurality of plates and the flexible display, and a second support layer of the plurality of support layers is disposed between a second plate of the plurality of plates and the flexible display; and
a plurality of buffer layers, each of the buffer layers being disposed to be separated from each other with respect to the folding area of the electronic device,
wherein a first buffer layer of the plurality of buffer layers is coupled to the first support layer and disposed between the first support layer and the first plate, and a second buffer layer of the plurality of buffer layers is coupled to the second support layer and disposed between the second support layer and the second plate, and
wherein the plurality of buffer layers absorb at least one of recess or hole formed on a surface of the plurality of plates.