US 12,228,955 B2
System-on-chip including low-dropout regulator
Seki Kim, Suwon-si (KR); Sangho Kim, Suwon-si (KR); Yongjin Lee, Goyang-si (KR); Hyongmin Lee, Seoul (KR); Dongha Lee, Suwon-si (KR); Byeongbae Lee, Hwaseong-si (KR); and Sungyong Lee, Hwaseong-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Nov. 3, 2023, as Appl. No. 18/501,721.
Application 18/501,721 is a continuation of application No. 17/845,541, filed on Jun. 21, 2022, granted, now 11,846,958.
Claims priority of application No. 10-2021-0080364 (KR), filed on Jun. 21, 2021; and application No. 10-2021-0103480 (KR), filed on Aug. 5, 2021.
Prior Publication US 2024/0061458 A1, Feb. 22, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. G05F 1/575 (2006.01); G05F 1/46 (2006.01)
CPC G05F 1/575 (2013.01) [G05F 1/46 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A system-on-chip comprising:
a core comprising:
a header switch circuit including a plurality of header switches configured to transmit a power supply voltage, applied to a first power rail, as a supply voltage to a second power rail; and
a logic circuit configured to operate based on the supply voltage received from the second power rail;
a low-dropout (LDO) regulator configured to control on/off states of first header switches among the plurality of header switches based on a power state of the core and the supply voltage; and
a power management unit (PMU) configured to control power gating of the core, by collectively turning on or turning off on/off second header switches among the plurality of header switches to control a power-on state or a power-off state of the core.