US 12,228,857 B2
Solution, solution storage body, actinic ray-sensitive or radiation-sensitive resin composition, pattern forming method, and manufacturing method of semiconductor device
Tetsuya Kamimura, Haibara-gun (JP)
Assigned to FUJIFILM Corporation, Tokyo (JP)
Filed by FUJIFILM Corporation, Tokyo (JP)
Filed on Dec. 28, 2022, as Appl. No. 18/147,228.
Application 18/147,228 is a division of application No. 16/289,813, filed on Mar. 1, 2019, granted, now 11,573,489.
Application 16/289,813 is a continuation of application No. PCT/JP2017/031543, filed on Sep. 1, 2017.
Claims priority of application No. 2016-172239 (JP), filed on Sep. 2, 2016; and application No. 2017-166461 (JP), filed on Aug. 31, 2017.
Prior Publication US 2023/0135117 A1, May 4, 2023
Int. Cl. G03F 7/004 (2006.01); G03F 7/00 (2006.01); G03F 7/038 (2006.01); G03F 7/039 (2006.01); G03F 7/075 (2006.01); G03F 7/16 (2006.01); G03F 7/20 (2006.01); G03F 7/32 (2006.01); G03F 7/38 (2006.01); H01L 21/027 (2006.01)
CPC G03F 7/0048 (2013.01) [G03F 7/0012 (2013.01); G03F 7/0044 (2013.01); G03F 7/0046 (2013.01); G03F 7/038 (2013.01); G03F 7/039 (2013.01); G03F 7/0392 (2013.01); G03F 7/0397 (2013.01); G03F 7/0757 (2013.01); G03F 7/16 (2013.01); G03F 7/162 (2013.01); G03F 7/168 (2013.01); G03F 7/2006 (2013.01); G03F 7/2041 (2013.01); G03F 7/32 (2013.01); G03F 7/325 (2013.01); G03F 7/38 (2013.01); H01L 21/027 (2013.01); H01L 21/0274 (2013.01)] 4 Claims
 
1. An actinic ray-sensitive or radiation-sensitive resin composition comprising:
a solution comprising:
at least one kind of organic solvent having a boiling point lower than 200° C.; and
an organic impurity having a boiling point equal to or higher than 250° C.,
wherein a content of the organic solvent with respect to a total mass of the solution is equal to or greater than 98% by mass,
a content of the organic impurity with respect to the total mass of the solution is equal to or greater than 0.1 mass ppm and less than 100 mass ppm, and
the organic impurity is at least one kind of compound selected from the group consisting of dioctyl phthalate, diisononyl phthalate, dioctyl adipate, dibutyl phthalate, ethylene propylene rubber, dimethyl phthalate, p-Toluic acid, bis (2-ethylhexyl) phthalate, addition polymer of 5-ethylidene-2-norbornene represented by the following structural formula,

OG Complex Work Unit Chemistry
addition polymer of cyclopentadiene represented by the following structural formula,

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addition polymer of 1,4-hexadiene represented by the following structural formula,

OG Complex Work Unit Chemistry
diisodecyl phthalate, bis (2-propylheptyl) phthalate, benzyl butyl phthalate, diisooctyl phthalate, diethyl phthalate, diisobutyl phthalate, tris (2-ethylhexyl) trimellitate, tris (n-octyl-n-decyl) trimellitate, bis (2-ethylhexyl) adipate, monomethyl adipate, dibutyl sebacate, dibutyl maleate, diisobutyl maleate, dioctyl terephthalate, diisononyl 1,2-cyclohexanedicarboxylic acid ester, epoxidized vegetable oil, N-(2-hydroxypropyl) benzene sulfonamide, N-(n-butyl) benzene sulfonamide, tricresyl phosphate, tributyl phosphate, triethyl citrate, acetyl triethyl citrate, tributyl citrate, acetyl tributyl citrate, trioctyl citrate, acetyl trioctyl citrate, trihexyl citrate, acetyl trihexyl citrate, and epoxidized soybean oil; and
a resin P having a repeating unit represented by Formula (AI):

OG Complex Work Unit Chemistry
in Formula (AI),
Xa1 represents a hydrogen atom or an alkyl group which may have a substituent,
T represents a single bond or a divalent linking group,
Ra1 to Ra3 each independently represent an alkyl group or a cycloalkyl group, and two out of Ra1 to Ra3 may form a cycloalkyl group by being bonded to each other.