US 12,228,778 B2
Optoelectronic package
Jr-Wei Lin, Kaohsiung (TW); and Mei-Ju Lu, Kaohsiung (TW)
Assigned to ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung (TW)
Filed by Advanced Semiconductor Engineering, Inc., Kaohsiung (TW)
Filed on Jul. 15, 2022, as Appl. No. 17/866,400.
Prior Publication US 2024/0019647 A1, Jan. 18, 2024
Int. Cl. G02B 6/26 (2006.01); G02B 6/30 (2006.01); G02B 6/42 (2006.01); B82Y 20/00 (2011.01); G02B 6/10 (2006.01); G02B 6/12 (2006.01); G02B 6/122 (2006.01); G02B 6/36 (2006.01)
CPC G02B 6/4231 (2013.01) [G02B 6/262 (2013.01); G02B 6/264 (2013.01); G02B 6/30 (2013.01); G02B 6/4206 (2013.01); B82Y 20/00 (2013.01); G02B 6/107 (2013.01); G02B 2006/1213 (2013.01); G02B 6/1225 (2013.01); G02B 6/3636 (2013.01); G02B 6/4212 (2013.01)] 10 Claims
OG exemplary drawing
 
1. An optoelectronic package, comprising:
a photonic integrated circuit (PIC) comprising an optical transmission portion including a plurality of first terminals exposed from a first surface of the PIC, wherein the PIC is configured to make a conversion between optical signals and electric signals;
an optical component facing the first surface of the PIC, wherein the optical component is configured to transmit the optical signals to or receive the optical signals from the optical transmission portion; and
a connection element disposed between the first surface of the PIC and the optical component, wherein the connection element is configured to reshape the optical signals, the connection element comprises a first structure portion supported by the optical transmission portion of the PIC and a second structure portion supported by the optical component, and the first structure portion is spaced apart from the second structure portion, and wherein the first structure portion comprises an extension portion disposed over the optical transmission portion of the PIC.