US 12,228,776 B2
Package with integrated optical die and method forming same
Chen-Hua Yu, Hsinchu (TW); and Jiun Yi Wu, Zhongli (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Mar. 24, 2022, as Appl. No. 17/656,248.
Claims priority of provisional application 63/267,322, filed on Jan. 31, 2022.
Prior Publication US 2023/0244043 A1, Aug. 3, 2023
Int. Cl. G02B 6/42 (2006.01); H01L 27/146 (2006.01)
CPC G02B 6/4206 (2013.01) [H01L 27/14618 (2013.01); H01L 27/14625 (2013.01); H01L 27/14627 (2013.01); H01L 27/14634 (2013.01); H01L 27/1464 (2013.01); H01L 27/14685 (2013.01); H01L 27/1469 (2013.01); H01L 27/14698 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method comprising:
forming a first package comprising an optical die and a protection layer attached to the optical die, wherein the optical die comprises a micro lens, and wherein the protection layer and the micro lens are on a same side of the optical die;
encapsulating the first package in a first encapsulant;
planarizing the first encapsulant to reveal the protection layer; and
removing the protection layer to form a recess in the first encapsulant, wherein the optical die is underlying the recess, with the micro lens facing the recess, wherein after the protection layer is removed, a portion of the recess extends into the first encapsulant, and extends to a level lower than a back surface of the optical die, and wherein the portion of the recess extending into the first encapsulant forms a recess ring encircling the optical die.