US 12,228,728 B2
Mirror systems
Horst Theuss, Wenzenbach (DE); Klaus Elian, Alteglofsheim (DE); and Cyrus Ghahremani, Regensburg (DE)
Assigned to Infineon Technologies AG, Neubiberg (DE)
Filed by Infineon Technologies AG, Neubiberg (DE)
Filed on Apr. 19, 2022, as Appl. No. 17/659,749.
Claims priority of application No. 102021111902.2 (DE), filed on May 6, 2021.
Prior Publication US 2022/0373784 A1, Nov. 24, 2022
Int. Cl. G02B 26/08 (2006.01); G02B 7/182 (2021.01); G02B 26/10 (2006.01); G02B 27/14 (2006.01)
CPC G02B 26/0833 (2013.01) [G02B 7/1821 (2013.01); G02B 26/101 (2013.01); G02B 27/14 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A mirror system, comprising:
a carrier;
a first chip package arranged on a surface of the carrier and comprising a first microelectromechanical system (MEMS) mirror;
a second chip package arranged on the surface of the carrier and comprising a second MEMS mirror; and
a reflective element arranged over the surface of the carrier and above the first chip package and the second chip package, wherein a radiation that is incident in the mirror system and is reflected by the first MEMS mirror in a direction of the reflective element is reflected by the reflective element in a direction of the second MEMS mirror.