US 12,228,603 B2
Wafer-level semiconductor high-voltage reliability test fixture
Zhe Lian, Suzhou (CN); Pengsong Xu, Suzhou (CN); Jianjun Huang, Suzhou (CN); and Haiyang Hu, Suzhou (CN)
Assigned to SEMIGHT INSTRUMENTS CO., LTD, Suzhou (CN)
Filed by SEMIGHT INSTRUMENTS CO., LTD, Suzhou (CN)
Filed on Jan. 30, 2024, as Appl. No. 18/427,064.
Application 18/427,064 is a continuation of application No. PCT/CN2023/134123, filed on Nov. 24, 2023.
Claims priority of application No. 202310820196.8 (CN), filed on Jul. 5, 2023.
Prior Publication US 2025/0012845 A1, Jan. 9, 2025
Int. Cl. G01R 31/26 (2020.01)
CPC G01R 31/2621 (2013.01) 9 Claims
OG exemplary drawing
 
1. A wafer-level semiconductor high-voltage reliability test fixture, comprising:
a first insulation plate, a first circuit board, and a second insulation plate arranged in sequence;
a first heating sheet, disposed on a side of the second insulation plate away from the target object;
a second circuit board, configured to transmit heating electrical signals to the first heating sheet and disposed on a side of the first insulation plate away from the first circuit board; and
an insulation block, disposed at the position of the target object,
wherein:
a target object is disposed between the first circuit board and the second insulation plate;
a side of the first circuit board facing the target object is provided with a probe holder, and probes are provided on the probe holder;
the first circuit board is connected to the target object through the probes such that a high-voltage electrical signal is transmitted to the target object through the probes for high-voltage performance testing when the high-voltage electrical signal is applied to the first circuit board;
the first insulation plate and the second insulation plate isolate the high-voltage electrical signal from the outside world;
the probes are also configured to transmit a test electrical signal to the target object and transmit a feedback signal to the first circuit board when the test electrical signal is applied to the first circuit board;
the insulation block is provided with a plurality of first through holes and conductive posts are provided in the plurality of first through holes;
the second insulation plate is provided with second through holes for the conductive posts to pass through, such that one end of one conductive post is connected to one corresponding probe and another end of the conductive post is connected to the first heating sheet after passing through one corresponding first through hole and one corresponding second through hole; and
the heating electrical signals pass through the first insulation plate and the first circuit board, and are transmitted to the first heating sheet through the probes and the conductive posts.