US 12,228,538 B2
Moisture sensor having integrated heating element
Abhijeet Paul, Escondido, CA (US); and Mishel Matloubian, San Diego, CA (US)
Assigned to QUALCOMM Incorporated, San Diego, CA (US)
Filed by QUALCOMM Incorporated, San Diego, CA (US)
Filed on Mar. 24, 2023, as Appl. No. 18/189,494.
Prior Publication US 2024/0319127 A1, Sep. 26, 2024
Int. Cl. G01N 27/22 (2006.01)
CPC G01N 27/225 (2013.01) [G01N 27/228 (2013.01)] 34 Claims
OG exemplary drawing
 
1. A device comprising:
a first patterned metal layer;
a first dielectric layer disposed over the first patterned metal layer;
a second patterned metal layer disposed over the first dielectric layer, wherein the first patterned metal layer, the first dielectric layer, and the second patterned metal layer form a first capacitor;
a second moisture-sensitive dielectric layer disposed over the second patterned metal layer; and
a third patterned metal layer disposed over the second moisture-sensitive dielectric layer, wherein
the third patterned metal layer, the second moisture-sensitive dielectric layer, and the second patterned metal layer form a second capacitor,
the second patterned metal layer is shared with the first capacitor, and
the first patterned metal layer is further configured for connection to electrical power as a heating element to assist in removing moisture from the second moisture-sensitive dielectric layer of the second capacitor.