US 12,228,461 B2
Temperature sensing device and system on chip
Jung Hyun Park, Seoul (KR); Kwang Ho Kim, Yongin-si (KR); Joo Seong Kim, Seoul (KR); and Jun Hyeok Yang, Seoul (KR)
Assigned to Samsung Electronics Co., Ltd., Gyeonggi-do (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Dec. 27, 2021, as Appl. No. 17/562,217.
Claims priority of application No. 10-2021-0041701 (KR), filed on Mar. 31, 2021.
Prior Publication US 2022/0316957 A1, Oct. 6, 2022
Int. Cl. G01K 7/16 (2006.01); G01K 1/02 (2021.01); G01K 7/24 (2006.01); G01K 7/34 (2006.01)
CPC G01K 7/16 (2013.01) [G01K 1/026 (2013.01); G01K 7/24 (2013.01); G01K 7/34 (2013.01); G01K 2219/00 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A temperature sensing device comprising:
a first temperature sensor including a first resistor element and a first capacitor, the first temperature sensor configured to generate a first voltage applied to at least one of the first resistor element or the first capacitor based on a first switch configured to be controlled by a first clock signal and a second switch configured to be controlled by a second clock signal, the second clock signal generated by delaying the first clock signal;
a second temperature sensor including a second resistor element and a second capacitor, the second temperature sensor configured to generate a second voltage applied to at least one of the second resistor element or the second capacitor based on the first clock signal and the second clock signal;
a controller configured to generate temperature code data based on the first voltage and the second voltage, and generate a control signal based on the temperature code data; and
a delay locked loop circuit configured to delay the first clock signal based on the control signal to generate the second clock signal.