US 12,228,390 B2
Information processing apparatus, information processing method and computer-readable recording medium
Masahide Tadokoro, Kumamoto (JP); Masashi Enomoto, Kumamoto (JP); Toyohisa Tsuruda, Kumamoto (JP); Hiroshi Nakamura, Kumamoto (JP); and Kazuhiro Shiba, Kumamoto (JP)
Assigned to TOKYO ELECTRON LIMITED, Tokyo (JP)
Filed by Tokyo Electron Limited, Tokyo (JP)
Filed on Feb. 17, 2021, as Appl. No. 17/177,289.
Claims priority of application No. 2020-028156 (JP), filed on Feb. 21, 2020.
Prior Publication US 2021/0262781 A1, Aug. 26, 2021
Int. Cl. G01B 11/06 (2006.01); H01L 21/67 (2006.01)
CPC G01B 11/0616 (2013.01) [H01L 21/6715 (2013.01); H01L 21/67253 (2013.01)] 17 Claims
OG exemplary drawing
 
1. An information processing apparatus, comprising:
at least one processor;
at least one memory storing program; and
a wind speed sensor configured to measure a wind speed of an inside of a substrate processing apparatus,
where the at least one memory and the program are configured, with the at least one processor, to cause the apparatus to:
calculate, based on a film thickness model representing a relationship between a state of the substrate processing apparatus and a film thickness of a coating film formed on a front surface of a substrate by the substrate processing apparatus and pre-data representing the state of the substrate processing apparatus before the substrate is processed by the substrate processing apparatus, a predicted film thickness when the substrate is processed by the substrate processing apparatus,
output, based on the predicted film thickness, instruction information indicating whether or not to continue the processing of the substrate,
calculate, based on the predicted film thickness, a processing condition of the substrate processed by the substrate processing apparatus,
output instruction information on a processing of the substrate including the processing condition calculated based on the predicted film thickness before the substrate is processed by the substrate processing apparatus, and
control, based on the processing condition of the substrate, the substrate processing apparatus,
wherein the pre-data includes the wind speed measured by the wind speed sensor,
wherein the film thickness model is represented as a multiple regression equation containing multiple partial regression coefficients and multiple explanatory variables, and
wherein the multiple partial regression coefficients include a value that varies depending on the wind speed of the inside of the substrate processing apparatus.