US 12,228,241 B1
Toolless mounting of electronic devices
Joshua Rosenthal, San Jose, CA (US); and John James Musante, Holtsville, NY (US)
Assigned to Juniper Networks, Inc., Sunnyvale, CA (US)
Filed by Juniper Networks, Inc., Sunnyvale, CA (US)
Filed on Jun. 23, 2023, as Appl. No. 18/340,514.
Application 18/340,514 is a continuation of application No. 17/662,326, filed on May 6, 2022, granted, now 11,725,775.
Application 17/662,326 is a continuation of application No. 16/517,380, filed on Jul. 19, 2019, granted, now 11,326,735, issued on May 10, 2022.
Claims priority of provisional application 62/701,610, filed on Jul. 21, 2018.
This patent is subject to a terminal disclaimer.
Int. Cl. F16M 13/00 (2006.01); E04B 9/00 (2006.01); F16M 13/02 (2006.01)
CPC F16M 13/02 (2013.01) [E04B 9/006 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A kit for a bracket assembly to suspend a device from an elongate structural support, the kit comprising:
a composite adapter formed by a pair of adapter parts that are configured for toolless connection to one another by longitudinal sliding engagement to resist lateral separation, each adapter part having a respective mounting formation configured for lateral reception therein of at least part of the elongate structural support to suspend the composite adapter from the structural support when both mounting formations are engaged with the structural support; and
a mounting bracket comprising:
a bracket plate having an attachment mechanism configured to secure the device to the bracket plate; and
a fastening mechanism incorporated in the bracket plate and configured to suspend the bracket plate from the composite adapter.