US 12,227,863 B2
Anodizing method and manufacturing method for an anisotropic conductive member
Yoshinori Hotta, Haibara-gun (JP); and Shunji Kurooka, Haibara-gun (JP)
Assigned to FUJIFILM Corporation, Tokyo (JP)
Filed by FUJIFILM Corporation, Tokyo (JP)
Filed on Aug. 6, 2021, as Appl. No. 17/395,653.
Application 17/395,653 is a continuation of application No. PCT/JP2020/000545, filed on Jan. 10, 2020.
Claims priority of application No. 2019-025182 (JP), filed on Feb. 15, 2019.
Prior Publication US 2021/0363653 A1, Nov. 25, 2021
Int. Cl. C25D 11/20 (2006.01); C25D 11/12 (2006.01); H01B 13/00 (2006.01); H01L 21/48 (2006.01)
CPC C25D 11/20 (2013.01) [C25D 11/12 (2013.01); H01B 13/0036 (2013.01); H01L 21/486 (2013.01)] 16 Claims
OG exemplary drawing
 
1. An anodizing method comprising:
subjecting a surface of a valve metal plate to a plurality of times of anodization; and
forming an anodized film having micropores present in a thickness direction of the valve metal plate and having a barrier layer present in a bottom part of the micropores, on the surface of the valve metal plate,
wherein in steps of second and subsequent times of anodization of the plurality of times of anodization, a current increasing period and a current keeping period are continuous,
the current increasing period is a period in which a quantity of current increase is more than 0 amperes per square meter per second and 0.2 amperes per square meter per second or less, and which is 10 minutes or less,
a current is kept at a constant value during the current keeping period, and the constant value is equal to or less than a maximum current value during the current increasing period, and
a counter electrode is arranged to face the valve metal plate, and a conductive load member is electrically connected in parallel with the valve metal plate.