| CPC C25D 1/003 (2013.01) [C25D 5/10 (2013.01); C25D 5/60 (2020.08); C25D 17/12 (2013.01); C25D 21/12 (2013.01); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12)] | 20 Claims |

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1. An electrochemical additive manufacturing method, comprising steps of:
positioning a first build plate into an electrolyte solution such that a conductive surface of a cathode portion of the first build plate directly contacts the electrolyte solution;
positioning a deposition anode array, comprising a plurality of deposition anodes, into the electrolyte solution such that a gap is established between the conductive surface of the cathode portion and the deposition anode array;
connecting the cathode portion to a power source;
connecting one or more deposition anodes of the plurality of deposition anodes to the power source;
transmitting electrical energy from the power source through the one or more deposition anodes of the plurality of deposition anodes, through the electrolyte solution, and to the conductive surface of the cathode portion, such that material is deposited onto the conductive surface of the cathode portion forms at least a portion of a component, wherein:
the first build plate comprises a thermal feature configured to transfer heat;
the material deposited onto the conductive surface is thermally coupled with the thermal feature to promote heat transfer by or to the thermal feature; and
the material deposited onto the conductive surface forms a heat wicking feature;
positioning a second build plate into the electrolyte solution such that a conductive surface of a cathode portion of the second build plate directly contacts the electrolyte solution;
positioning the deposition anode array into the electrolyte solution such that a gap is established between the conductive surface of the cathode portion of the second build plate and the deposition anode array;
connecting the cathode portion of the second build plate to the power source;
transmitting electrical energy from the power source through the one or more deposition anodes of the plurality of deposition anodes, through the electrolyte solution, and to the conductive surface of the cathode portion of the second build plate, such that material is deposited onto the conductive surface of the cathode portion of the second build plate forms at least a portion of a second component, wherein:
the second build plate comprises a second thermal feature configured to transfer heat;
the material deposited onto the conductive surface of the cathode portion of the second build plate is thermally coupled with the second thermal feature to promote heat transfer by or to the second thermal feature; and
the material deposited onto the conductive surface of the cathode portion of the second build plate forms a second heat wicking feature; and
coupling together opposing end portions of the first build plate to opposing end portions of the second build plate to define a sealed fluid channel between the first build plate and the second build plate, wherein the heat wicking feature and the second heat wicking feature are located within the sealed fluid channel.
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