US 12,227,841 B2
Ruthenium film forming method and substrate processing system
Tadahiro Ishizaka, Nirasaki (JP)
Assigned to TOKYO ELECTRON LIMITED, Tokyo (JP)
Filed by TOKYO ELECTRON LIMITED, Tokyo (JP)
Filed on Mar. 23, 2023, as Appl. No. 18/125,236.
Application 18/125,236 is a division of application No. 16/922,784, filed on Jul. 7, 2020, granted, now 11,680,320.
Claims priority of application No. 2019-129545 (JP), filed on Jul. 11, 2019.
Prior Publication US 2023/0227973 A1, Jul. 20, 2023
Int. Cl. H01L 21/67 (2006.01); C23C 16/02 (2006.01); C23C 16/06 (2006.01); C23C 16/16 (2006.01); C23C 16/455 (2006.01); H01L 21/285 (2006.01); H01L 21/3205 (2006.01); H01L 21/768 (2006.01)
CPC C23C 16/45536 (2013.01) [C23C 16/0272 (2013.01); C23C 16/06 (2013.01); C23C 16/16 (2013.01); H01L 21/285 (2013.01); H01L 21/28568 (2013.01); H01L 21/3205 (2013.01); H01L 21/67017 (2013.01); H01L 21/76877 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A ruthenium film forming method in a substrate processing system, comprising:
a plurality of processing containers connected to a vacuum transfer chamber;
a controller configured to perform steps of;
forming an inhibition layer in a recess by supplying a chlorine-containing gas to a substrate including an insulating film and having the recess in a depressurized state; and
forming a ruthenium film in the recess by supplying a Ru-containing precursor to the recess in which the inhibition layer is formed in the depressurized state,
wherein the forming the inhibition layer includes adsorbing chlorine to a top surface and an upper portion of a side surface of the recess without adsorbing chlorine to a bottom surface and a lower portion of the side surface of the recess, so that in the forming the ruthenium film, the chlorine adsorbed to the recess inhibits adsorption of the Ru-containing precursor to the recess, and
wherein the forming the inhibition layer and the forming the ruthenium film are alternately and repeatedly executed to perform bottom-up formation in which film formation gradually progresses upward from the bottom surface of the recess.