US 12,227,840 B2
Substrate support with varying depths of areas between mesas and corresponding temperature dependent method of fabricating
Keith Gaff, Fremont, CA (US); Devin Ramdutt, Fremont, CA (US); and Ann Erickson, Lake Oswego, OR (US)
Assigned to Lam Research Corporation, Fremont, CA (US)
Filed by LAM RESEARCH CORPORATION, Fremont, CA (US)
Filed on Aug. 4, 2022, as Appl. No. 17/880,855.
Application 17/880,855 is a continuation of application No. 15/363,558, filed on Nov. 29, 2016, abandoned.
Prior Publication US 2022/0380894 A1, Dec. 1, 2022
Int. Cl. C23C 16/44 (2006.01); C23C 16/46 (2006.01); C23C 16/505 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01)
CPC C23C 16/4411 (2013.01) [C23C 16/463 (2013.01); C23C 16/505 (2013.01); H01L 21/67109 (2013.01); H01L 21/67248 (2013.01); H01L 21/6875 (2013.01)] 29 Claims
OG exemplary drawing
 
1. A method comprising:
determining a temperature distribution pattern across a substrate or a support plate of a substrate support;
determining, based on the temperature distribution pattern, a number of masks to apply to a top surface of the support plate, wherein the number of masks is greater than or equal to two;
determining patterns of the masks based on the temperature distribution pattern;
applying the masks over the top surface of the support plate;
performing a first machining process to remove a portion of the support plate unprotected by the masks to form first mesas and first recessed areas between the first mesas;
removing a first one of the masks from the support plate;
performing a second machining process to form second recessed areas and a first seal band area, wherein the second machining process to form the first seal band area includes forming a pair of seal bands of the first seal band area, wherein the second machining process includes increasing depths of the first recessed areas, and wherein, subsequent to performing the second machining process, the depths of the first recessed areas are greater than the depths of the second recessed areas; and
removing a second one of the masks from the support plate.
 
16. A method comprising:
determining a temperature distribution pattern across a substrate or a support plate of a substrate support;
determining, based on the temperature distribution pattern, a number of masks to apply to a top surface of the support plate, wherein the number of masks is greater than or equal to two;
determining patterns of the masks based on the temperature distribution pattern;
applying the masks over the top surface of the support plate;
performing a first machining process to remove a portion of the support plate unprotected by the masks to form first mesas and first recessed areas between the first mesas;
removing a first one of the masks from the support plate;
performing a second machining process to form second recessed areas, second mesas and a first seal band area, wherein the second mesas are separate from the first mesas; and
removing a second one of the masks from the support plate.