US 12,227,838 B2
Substrate processing apparatus and substrate processing method using same
Ban Seok You, Seoul (KR); Woo Seok Jang, Gyeonggi-do (KR); Min Jung Choi, Gyeonggi-do (KR); and Ki Duk Tak, Gyeonggi-do (KR)
Assigned to SEMES CO., LTD., Chungcheongnam-Do (KR)
Filed by SEMES CO., LTD., Chungcheongnam-do (KR)
Filed on Aug. 12, 2022, as Appl. No. 17/886,474.
Claims priority of application No. 10-2021-0163880 (KR), filed on Nov. 25, 2021.
Prior Publication US 2023/0160061 A1, May 25, 2023
Int. Cl. C23C 16/24 (2006.01); C23C 16/44 (2006.01); C23C 16/455 (2006.01); H01J 37/32 (2006.01)
CPC C23C 16/4405 (2013.01) [C23C 16/45565 (2013.01); H01J 37/32532 (2013.01)] 4 Claims
OG exemplary drawing
 
4. A method of processing a substrate by using a substrate processing apparatus including a chamber, a shower head unit for supplying a cleaning gas into the chamber, a first electrode disposed on an upper portion of the shower head unit, a support unit for supporting the substrate, and a second electrode disposed inside the support unit, the method comprising:
supplying the cleaning gas into the chamber; and
supplying a voltage of a first magnitude to the first electrode and supplying a voltage of a second magnitude greater than the first magnitude to the second electrode,
wherein the shower head unit has a body and a plurality of gas injection holes formed to penetrate the body, the first electrode is disposed inside the chamber, and the plurality of gas injection holes of the shower head unit are not formed above the first electrode and are formed between the first electrode and the second electrode.