US 12,227,837 B2
Ex situ coating of chamber components for semiconductor processing
Damodar Rajaram Shanbhag, Beaverton, OR (US); Guangbi Yuan, Beaverton, OR (US); Thadeous Bamford, Portland, OR (US); Curtis Warren Bailey, West Linn, OR (US); Tony Kaushal, Campbell, CA (US); Krishna Birru, Fremont, CA (US); William Schlosser, Tigard, OR (US); Bo Gong, Sherwood, OR (US); Huatan Qiu, Portland, OR (US); Fengyuan Lai, Sherwood, OR (US); Leonard Wai Fung Kho, San Francisco, CA (US); Anand Chandrashekar, Fremont, CA (US); Andrew H. Breninger, Hillsboro, OR (US); Chen-Hua Hsu, Sherwood, OR (US); Geoffrey Hohn, Portland, OR (US); Gang Liu, Fremont, CA (US); and Rohit Khare, San Ramon, CA (US)
Assigned to Lam Research Corporation, Fremont, CA (US)
Filed by Lam Research Corporation, Fremont, CA (US)
Filed on May 16, 2022, as Appl. No. 17/663,614.
Application 17/663,614 is a continuation of application No. 16/935,760, filed on Jul. 22, 2020, granted, now 11,365,479.
Application 16/935,760 is a continuation of application No. 15/954,454, filed on Apr. 16, 2018, granted, now 10,760,158, issued on Sep. 1, 2020.
Claims priority of provisional application 62/599,618, filed on Dec. 15, 2017.
Prior Publication US 2022/0275504 A1, Sep. 1, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. C23C 16/44 (2006.01); C23C 16/40 (2006.01); C23C 16/455 (2006.01); H01J 37/32 (2006.01)
CPC C23C 16/4404 (2013.01) [C23C 16/401 (2013.01); C23C 16/4405 (2013.01); C23C 16/45519 (2013.01); C23C 16/45536 (2013.01); C23C 16/45565 (2013.01); H01J 37/3244 (2013.01); H01J 37/32862 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A method of coating a chamber component, the method comprising:
(a) receiving the chamber component as a substrate in a first reaction chamber;
(b) reacting a first reactant with a second reactant in the first reaction chamber to form a protective coating on a surface of the chamber component;
(c) repeating (b) until the protective coating reaches a final thickness; and
(d) removing the chamber component from the first reaction chamber;
(e) installing the chamber component in a second reaction chamber; and
(f) exposing the second reaction chamber to a restoration plasma while the chamber component is installed therein to re-form the protective coating on the chamber component.