US 12,227,827 B2
Methods to impart color and durable properties to substrates
William Judson Ready, Atlanta, GA (US); Jason Hayes Nadler, Decatur, GA (US); Stephan Turano, Atlanta, GA (US); and Brent Karl Wagner, Marietta, GA (US)
Assigned to Georgia Tech Research Corporation, Atlanta, GA (US)
Filed by Georgia Tech Research Corporation, Atlanta, GA (US)
Filed on Nov. 29, 2018, as Appl. No. 16/204,625.
Claims priority of provisional application 62/591,866, filed on Nov. 29, 2017.
Prior Publication US 2019/0161847 A1, May 30, 2019
Int. Cl. C23C 14/34 (2006.01); C23C 14/00 (2006.01); C23C 14/02 (2006.01); C23C 14/04 (2006.01); C23C 14/06 (2006.01); H01M 50/109 (2021.01); H01M 50/545 (2021.01); H01M 50/562 (2021.01)
CPC C23C 14/0015 (2013.01) [C23C 14/02 (2013.01); C23C 14/042 (2013.01); C23C 14/0641 (2013.01); C23C 14/3471 (2013.01); H01M 50/109 (2021.01); H01M 50/545 (2021.01); H01M 50/562 (2021.01)] 24 Claims
OG exemplary drawing
 
1. A method of imparting color to a metal substrate, the method comprising:
depositing an electrically conductive colored coating onto a surface of the metal substrate to a thickness from about 10 nm to about 90 nm, wherein the electrically conductive colored coating reflects light within a wavelength range from 400 nm to 700 nm, wherein the electrically conductive colored coating comprises titanium nitride, and
controlling a color of the metal substrate by controlling the thickness of the coating, wherein the metal substrate comprises nickel, stainless steel, aluminum, or combinations thereof, and the metal substrate exhibits a change in color with increasing thickness of the electrically conductive colored coating, that is independent of component(s) in the coating,
wherein depositing the electrically conductive colored coating is by radio frequency sputtering at a vacuum pressure of from about 5 mTorr to about 25 mTorr, with a power from about 200 W to about 500 W, and using an inert gas having a flow rate of from about 5 standard cubic centimeters per minute (sccm) to about 15 sccm as a sputtering gas at a sputtering temperature of from about 25° C. to about 40° C., for about 0.1 min to about 10 mins, and wherein the metal substrate has a temperature of up to 350° C.,
wherein about means within 5%.